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Green Micro/Nano Electronics

书号：9787030363312

作者：王阳元
外文书名：Green Micro/Nano Electronics
装帧：圆脊精装

开本：B5
页数：920

字数：400

语种：
出版社：科学出版社

出版时间：2015-12-02
所属分类：TN4 微电子学、集成电路（IC）
定价： ￥218.00元

售价： ￥172.22元

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　　首次提出“绿色微纳电子学”的概念，分别从能源经济、社会文化、低功耗集成电路设计、绿色集成电路芯片制造、绿色电子封装、微纳电子新器件结构、绿色存储器的发展和集成微纳系统等各个角度对绿色微纳电子学进行阐述，介绍这些方面国内外学术界和工业界的最新进展；此外，还从新能源的应用角度，对半导体绿色照明光源、薄膜太阳能电池等有关领域的发展进行了学术探讨。

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1.1 Energy Generation and Reserves

1.1.1 Classifications of Energy Resources

1.1.2 Reserves of Conventional Energy

1.1.3 Reserves of New Energy

1.2 Use and Consumption of Energy

1.2.1 Use and Production of Energy

1.2.2 Energy Consumption in Life and Production

1.3 Energy and Economic Development

1.3.1 Energy as an Important Factor in Pushing Economic Growth

1.3.2 The Negative Impact of Energy Crisis on Economic Growth

1.3.3 Constraint of Population Growth on Energy Development

1.3.4 Constraints of Environmental Pollution on Energy Development

1.4 Policy Guidance and Measures of Saving Energy

1.4.1 Regulations for Environmental Protection

1.4.2 Tax Policy

1.4.3 Major Planning

1.4.4 Important Measures

1.5 Future Development of Integrated Circuits(IC)

1.5.1 Revolutionary Role of IC in Energy Conservation

1.5.2 Future Driving Force of IC Development Is Reducing Power Consumption

References

Chapter 2 Low Power IC Design

2.1 Power Source and Analysis of Integrated Circuits

2.1.1 Static Power

2.1.2 Dynamic Power

2.1.3 Power Analysis

2.1.4 Conclusion

2.2 Circuit-Level Low Power Design

2.2.1 Introduction

2.2.2 RTL-level Low Power Design

2.2.3 Gate-level Low Power Design

2.2.4 Layout-level Low Power Design

2.2.5 Asynchronous Circuit Design

2.2.6 Sub-threshold and Multi-voltage Design

2.2.7 Conclusions

2.3 System-level Low Power Design

2.3.1 Introduction

2.3.2 Dynamic Power Management

2.3.3 Dynamic Voltage Scaling

2.3.4 Low Power Compilation

2.3.5 Low Power Hardware/Software Co-design

2.4 Battery-Aware Low Power Design

2.4.1 Introduction

2.4.2 Battery Model and Battery Discharge Characteristics

2.4.3 Battery-Aware Task Scheduling

2.4.4 Battery-Driven Power Management

2.4.5 Conclusion

2.5 Low Power IC Design and Green IT

2.5.1 Rise of Green IT

2.5.2 Low Power IC Design for Green IT

2.5.3 Conclusion

Reference

Chapter 3 Green Technology for IC Manufacturing

3.1 IC Industry and Environment

3.2 IC manufacturing process introduction

3.3 Modern CMOS Process Flow

3.4 Dry Etching/Cleaning and Greenhouse Gas Emissions

3.4.1 Introduction of Dry Etching

3.4.2 Introduction of Dry Cleaning Process

3.4.3 Process Parameter Optimization

3.4.4 Technology of Exhaust Treatment for Dry and Wet Process

3.5 Wet Etching/Cleaning and Waste Chemicals

3.5.1 Wet Etching

3.5.2 Wet Cleaning in FEOL and BEOL

3.6 Photo-resist Pollution and Control in Lithography Processes

3.6.1 Introduction of Lithography Process and Photo-resist

3.6.2 Background Information on PFOS

3.6.3 Environmental and Health Impacts of Photo-resist

3.6.4 The Importance of PFOS for Lithography Processes

3.6.5 Environmental Friendly Photo-resist Materials

3.6.6 The R & D Trend for Environmental Friendly Photo-resists

3.7 Slurries in CMP and Environmental Considerations

3.7.1 Introduction of CMP Technology

3.7.2 Assessment of Environmental Impact of CMP Slurries

3.7.3 Classification and Characteristics of CMP Slurries

3.7.4 Slurry Disposal

3.7.5 Slurry Storage and Transportation

3.8 IC Manufacturing and Treatment of Waste Chemicals

3.8.1 Common Chemicals in IC Manufacturing

3.8.2 Liquid Chemicals and Waste Water Treatment

3.8.3 Gaseous Chemicals and Exhaust Treatment

3.8.4 Management of Hazardous Substances in IC Manufacturing

3.9 Low Power CMOS Technology for Friendly Environment

3.9.1 CMOS on SOI Technology

3.9.2 High-κ and Metal-gate(HKMG)Technology

3.9.3 Low-κ Interconnection

3.9.4 System-on-chip and System-in-package

3.10 Summary

Acknowledgements

References

Chapter 4 Green Electronic Materials and Advanced Packaging Technologies

4.1 Introduction

4.1.1 Background Information

4.1.2 The Importance of Lead-free Soldering in Green Electronics

4.2 IC Chip Packaging

4.2.1 Packaging Process

4.2.2 Classification of Packages

4.2.3 New Packaging Technologies

4.3 Co-design of Chip-Package-PCB

4.3.1 Challenges of Advanced Packaging

4.3.2 Chip-Package-PCB Co-design Process

4.3.3 Key Issues of Chip-Package-PCB Co-design

4.4 System-in-Package(SIP)and its Applications

4.4.1 Overview

4.4.2 Key Issues of SIP

4.4.3 Applications of SIP

4.5 Three-dimensional Packaging

4.5.1 Overview

4.5.2 Basics of Three-dimensional Packaging

4.5.3 Challenges of Three-dimensional Packaging Technology

4.5.4 Research and Applications of Three-dimensional Packaging

4.5.5 Summary and Development Trends

4.6 Applications of Green Nanocomposites in Advanced Packaging

4.7 Selection and Characterization of Solder Alloys for Pb-free Reflow Soldering

4.7.1 Pb-free Solder Paste Materials

4.7.2 Engineering Considerations and Recipe of Selected Solder Paste Materials

4.7.3 Flux

4.7.4 Characterization of Selected Solder Paste Materials

4.8 Board Level Reliability Test

4.8.1 Sample Description

4.8.2 Solder and Intermetallic Analysis after Reflow

4.8.3 Accelerated Thermal Cycling Test(ATC)

4.8.4 Package Shear/Pull Tests

4.8.5 Four-point Bending Test

4.8.6 Drop Test

4.9 Conclusions

References

Chapter 5 New Device Technologies for Green Micro/Nano Electronics

5.1 Overview

5.2 Dynamic Threshold Voltage Device and Adaptive Substrate Bias Technique

5.2.1 Dynamic Threshold Voltage MOS(DTMOS)Device with Gate-Body Connected

5.2.2 Adaptive Substrate Bias Technique for Low Voltage Circuits

5.3 Nanoscale New-structual MOSFETs with Low Leakage Current

5.3.1 Ultra-Thin Body SOI and Quasi-SOI Device

5.3.2 Novel Double-Gate MOS Device

5.3.3 Gate-All-Around Silicon Nanowire MOS Device

5.4 Novel-Mechanism Based Low Power Devices with Ultra-Steep Subthreshold Slope

5.4.1 Tunneling Field Effect Transistor

5.4.2 Impact Ionization MOS Device

5.4.3 Suspended-Gate MOSFET and NEM Relay

Acknowledgements

References

Chapter 6 Nanoelectronics from the Bottom-up:Materials,Devices and Circuits

6.1 Introduction

6.2 Carbon nanotube-based Nanoelectronics

6.2.1 Geometry and Electronic Structure

6.2.2 Synthesis of Aligned Carbon Nanotubes

6.2.3 Nanoelectronic Devices

6.2.4 Carbon Nanotube-based Circuits

6.3 Graphene-based Nanoelectronics

6.3.1 Synthesis and Transfer of Graphene

6.3.2 Electronic Structures and Properties of Graphene

6.3.3 Graphene-based Nanoelectronic Devices

6.4 Molecular Electronics

6.4.1 Brief History of Molecular Electronics

6.4.2 Molecular Electronic Devices

6.4.3 Molecular Electronic Circuits

6.5 Atomic Scale Devices

6.5.1 Single-Atom Transistor

6.5.2 Atomic Switch

6.5.3 Applications of Atomic Scale Devices

6.6 Summary

Acknowledgements

References

Chapter 7 Green Memory Technology

7.1 Overview of Semiconductor Memory Technologies

7.1.1 State-of-art Memory Technologies Toward Scaling Limit

7.1.2 Emerging Semiconductor Memory Technologies

7.2 Resistive Random Access Memory(RRAM)

7.2.1 Principle and Mechanisms

7.2.2 RRAM Characteristics

7.2.3 RRAM Technology

7.3 Phase-change Random Access Memory(PCRAM)

7.4 Magnetic Random Access Memory(MRAM)

7.5 Summary

Acknowledgements

References

Chapter 8 Microelectromechanical/Nanoelectrome chanical Systems and Their Applications

8.1 Background of MEMS

8.1.1 Definition of MEMS

8.1.2 Features of MEMS

8.1.3 Nanoelectromechanical System

8.1.4 Influence and State of MEMS/NEMS

8.2 Silicon-based Micromachining

8.2.1 Surface Micromachining Technology

8.2.2 Bulk Micromachining

8.3 Nanomachining Technology

8.3.1 Nano Lithography Technology

8.3.2 Nanoimprint Lithography

8.3.3 Spacer Technology

8.3.4 Fabrication of Nano-forests Based on Oxygen Plasma Removal of Photoresist

8.3.5 Nanosphere Self-assembly and Etching Technology

8.4 Categories and Applications of MEMS

8.4.1 Micromechanical Sensors

8.4.2 Optical MEMS

8.4.3 Microfluidics

8.4.4 Micro/Nano Bio-sensors/Bio-chips/BioMEMS

8.4.5 Applications of Micro/Nano Technology in System

8.5 RF MEMS

8.5.1 MEMS Switch/Relay

8.5.2 MEMS Inductors

8.5.3 Tunable Capacitors

8.5.4 Micromechanical Resonators and Filters

8.6 Power MEMS

8.6.1 Power Generator

8.6.2 Micro Energy Harvesting System

8.6.3 Mechanical Vibration

8.7 Environmental MEMS

8.7.1 Atmospheric Environmental Monitoring

8.7.2 Water Environmental Monitoring

8.7.3 Environmental Monitoring of Soil

8.7.4 Pathogenic Factors Monitoring

8.8 Trends and Prospects

Acknowledgements

References

Chapter 9 Photovoltaic Materials and Applications

9.1 Renewable Energy

9.1.1 PV Market and Roadmap

9.1.2 PV Materials and Applications

9.2 Principle of Solar Cell

9.2.1 PV Effect

9.2.2 J-V Characteristics

9.2.3 Quantum Efficiency

9.2.4 J-V Setup

9.2.5 QE Setup

9.3 Si Wafer PV Technology

9.3.1 Si Wafer

9.3.2 c-Si and Mc-Si Solar Cells

9.4 High Efficiency III-V

9.4.1 Concentrated Solar Cells

9.4.2 Multi-junction Solar Cells

9.5 Thin-film PV Technologies

9.5.1 TCO Material

9.5.2 A-Si & Nc-Si

9.5.3 CdTe

9.5.4 CIGS

9.5.5 DSSC

9.5.6 OPV

9.6 Innovative PV Technologies

9.6.1 Light Management

9.6.2 Nano-wire Solar Cell

9.6.3 Hot Carriers

9.6.4 Q-dot and Multi Exciton Generation

9.6.5 Intermediate Band Gap Solar Cell

9.7 Summary

References

Chapter 10 Solid State Lighting

10.1 An Overview of Solid State Lighting

10.1.1 Basic Concepts of Solid State Lighting

10.1.2 Basic Principles of Solid State Lighting

10.1.3 History and Current Developments of LEDs

10.2 Major Techniques of Solid State Lighting

10.2.1 Epitaxy

10.2.2 Device Fabrication

10.2.3 Packaging

10.3 LED Substrates

10.3.1 Sapphire

10.3.2 SIC

10.3.3 Si

10.3.4 GaN

10.3.5 ZnO

10.3.6 AlN

10.4 LEDs of Different Colors

10.4.1 Red LEDs

10.4.2 Green LEDs

10.4.3 Blue LEDs

10.4.4 Ultraviolet and Deep Ultraviolet LEDs

10.5 Progresses in LED Research

10.5.1 GaN Epitaxy

10.5.2 LEDs Device Morphology

10.6 OLED and PLED

10.6.1 Basic Concepts

10.6.2 Advantages of OLED/PLED

10.6.3 Applications

10.6.4 OLED/PLED Technological Advances

10.6.5 OLED/PLED Structure Evolution

10.7 Outlook

References

Chapter 11 AMOLED Displays:Pixel Circuits and Driving Schemes

11.1 Introduction

11.2 Current Driving Schemes

11.2.1 Stability and Non-uniformity in Current

11.2.2 Dynamic Effects

11.2.3 Settling Time in CPPCs

11.2.4 Techniques to Improve Programming Times in CPPCs

11.3 Voltage Driving Schemes

11.3.1 Imperfect Compensation

11.4 External Compensation

11.4.1 General Block Diagram

11.4.2 Current-comparator Based System

11.5 Conclusion and Outlook

References

Chapter 12 The Impact of Social Culture and Institutions on Green Micro/Nano Electronics

12.1 Connotation of Social Culture

12.1.1 The Medium of Culture

12.1.2 Culture Is a Reflection of the Economy

12.1.3 The Interaction between Culture and the Progress of Science and Technology

12.1.4 Soft Power of Culture

12.2 Guide to the Development of Green Micro/Nano Electronics by the Scientific Concept of Development

12.2.1 People-Centered Principle

12.2.2 Harmonious Coexistence with Nature

12.2.3 Development Environment with Harmony without Uniformity

12.2.4 Legal System,Rule by Law and Morality

12.3 Development of Green Micro/Nano Electronics Needs a Green Environment

12.3.1 Development of Science Needs a Peaceful Environment

12.3.2 Development of Science Needs a Harmonious Culture

12.3.3 Uniting and Cooperating,Letting Everyone Play a Role

12.3.4 Sharing Resources,Fully Using Our Equipment

12.3.5 Respecting Intellectual Property Rights

12.3.6 Paying Attention to Cultivating Personnel

References]]>

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